THERMAL ENGINEERED HEAT SPREADER & DISSIPATION SOLUTIONS

CARD CHASSIS

ELECTRIC VEHICLE BATTERIES

RAPID CURE CFRP PARTS

ANTI-GRAVITY HEAT PIPES

CPU COOLING

ELECTRONICS

CARD CHASSIS

ELECTRIC VEHICLE BATTERIES

RAPID CURE CFRP PARTS

ANTI-GRAVITY HEAT PIPES

CPU COOLING

ELECTRONICS

Ensure Sufficient Dissipation of Energy To Keep Your Systems Running

Thermal management is a crucial concern in many applications including material processing, food and pharmaceutical processing as well as commercial and consumer electronics.  The application and use of heat pipes in the thermal management of electronics and their associated and integrated systems is well known.  Acrolab’s Isobar heat pipes have been used in various electronics applications throughout the past four decades and our team of design and application engineers will assist your project team in identifying their  requirements and performance criteria to meet the challenge.

Heat sinks and heat spreaders are typically the primary form of two-phase heat transfer devices used in the thermal management of electronics systems and platforms.   This passive, solid state technology has become well known for its relatively  small footprint and high level of efficiency in moving heat energy from the heat source to the cooling source, usually an array of fins attached to the assembly and a forced air (fan) for cooling.

Isobar® Heat Sinks and Spreaders

However, as is the case with newer and more high-tech electronics requiring greater power dissipation, the standard fan and finned heat sink may no longer meet the required thermal specifications. An Isobar® heat sink is the preferred alternative in electronics cooling since it works using natural convection by harnessing the Isobar® heat pipe’s ability to transfer and dissipate heat energy efficiently and effectively, thus offering low thermal resistance and high power capability – the practical solution for modern electronics.

These sinks and spreaders move heat energy in order to cool the on-board processors to alleviate over-heating and potential performance degradation due to the build up of excess heat energy inside the electronics enclosure.  Some typical applications include computers, server farms, data storage devices, communications systems and aerospace systems.

Isobar® Heat Pipe Dissipates Heat Load Rapidly & Effectively

Whether you are cooling CPUs, GPUs or DIMM cards, electronic components generate heat and rejection of this heat is necessary for their optimum and reliable operation. For over 70 years we have supported the space, aerospace, and electronics sectors.

As electronics begin to require higher power transfer in more compact enclosures, dissipating the heat load becomes a critical design factor for modern electronics requiring more than the standard metallic heat sinks. From bent and formed heat pipes, to finned heat sink solutions, Acrolab’s Isobar® heat pipes are the preferred thermal management tool.

Isomandrels® in Filament Winding Applications

Acrolab Isomandrels incorporate the same technology used in the production of Isobar heat pipes.  The traditional mandrels used in the filament winding process are made from hollow steel tubes and designed to be placed into an oven for curing the wound part after the winding process has been completed.  The filament and resin used to create the wound tube can be in the form of a wet-wind or a pre-preg medium.  In either case, when the resin is heated to its transition temperature where the chemical reaction occurs, this can cause temperature spikes along the surface of the mandrel causing inconsistent and non-uniform curing of the winding.  Because of their design and technological advantage over regular mandrels, Isomandrels are capable of being pre-heated quickly and uniformly prior to being placed onto the winder for your next cycle.

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Isomandrels are extremely effective at redistributing this excess energy uniformly along the length of the mandrel providing a more reliable and consistent cure of the winding, while at the same time allowing for out-gassing of the winding due to the uniform heat generated along the length of the mandrel.  Our clients have been able to consider multiple options for curing their parts using Isomandrels.  Isomandrels can be uniformly cooled or heated and can even be used to cure filament wound parts while on the winding machine, even while winding.  They can also be utilized in ovens or in arranged in a manufacturing cell for increased production.

Isomandrels® Add Flexibility to the Curing Process

Isomandrels® can provide more flexibility to the curing process for filament winding applications by providing the ability to pre-heat the mandrels quickly and uniformly in a matter of minutes prior to starting the wind schedule, increasing the through-put of mandrels in the curing oven(s) and even allowing for out-of-oven curing for special projects and low-volume production products.

A recent feasibility study with one of our clients demonstrated that their current production process, using Isomandrels,  could double their current rate with one quarter the number of mandrels and almost zero scrap based on the high yield achieved with the consistent and uniform thermal performance of the Isomandrel.  The application still incorporated the existing curing ovens at the plant, however further work is underway to establish an Isomandrel production cell to further develop their processes and conduct research and development projects concurrently without having to disrupt regular production.

Development Of Thermal Management Systems for Battery Electric Vehicles

  • Challenge: To develop a new thermal management concept to improve the efficiency and reliability of the battery thermal management system used in Battery Electric Vehicles (BEV).
  • Application: Electronics Cooling.

Acrolab’s initial concept would be a two-phase flow battery thermal management system, providing a higher heat transfer coefficient inside the cold plate and a more compact design. Three concepts were investigated in this case; a simplified Isobar® heat pipe (HP) concept, a capillary pumped loop (CPL) heat pipe concept, and a mechanical pump assisted two-phase loop (2MPDL) concept.

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